A computational analysis of universal behavior of thermal groove in a moving grain boundary

Verma, M. and Sugathan, S. and Bhattacharya, Saswata and et al, . (2022) A computational analysis of universal behavior of thermal groove in a moving grain boundary. Scripta Materialia, 209. pp. 1-7. ISSN 1359-6462

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We report the existence of universal behavior of a mobile thermal groove in polycrystalline thin films using a novel three-dimensional phase-field model. The universal behavior is independent of film thickness, surface diffusivity and grain boundary mobility when grain boundary motion is in steady-state. Moreover, the simulated universal curve shows excellent agreement with Mullins’ theory of mobile grooves for any groove shape. Onset of universality of surface profiles is concomitant with the attainment of steady-state motion of the grain boundary and a constant value of groove depth. On the other hand, in the case of thinner films, the interaction between the groove and the grain boundary leads to partial stagnation of the boundary. Even for grooves attached to decelerating boundaries we observe self-similarity of surface profiles, although this self-similar behavior is different from the ones associated with steady-state boundaries. © 2021 Acta Materialia Inc.

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IITH Creators:
IITH CreatorsORCiD
Bhattacharya, SaswataUNSPECIFIED
Item Type: Article
Additional Information: Dr. R. Mukherjee and M. Verma would like to thank IIT Kanpur for the financial support through Initiation Grant (IITK/MET/2014228 ).
Uncontrolled Keywords: Grain boundary migration; Phase-field model; Thermal grooving; Thin film
Subjects: Others > Metallurgy Metallurgical Engineering
Materials Engineering > Materials engineering
Divisions: Department of Material Science Engineering
Depositing User: . LibTrainee 2021
Date Deposited: 18 Jul 2022 12:09
Last Modified: 18 Jul 2022 12:09
URI: http://raiith.iith.ac.in/id/eprint/9619
Publisher URL: http://doi.org/10.1016/j.scriptamat.2021.114383
OA policy: https://v2.sherpa.ac.uk/id/publication/4703
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