Thermal stability of pulse electroplated gold films: SEM-EBSD studies

Palli, Srinivas and Dey, Suhash Ranjan (2017) Thermal stability of pulse electroplated gold films: SEM-EBSD studies. Advanced Material Science, 2 (1). ISSN 23986883

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This paper reports the effect of annealing at various temperatures on microstructure and microtexture of the gold films deposited onto SiO2 /Si(100) substrate using pulsed electrodeposition (PED). The samples were annealed for 3 days at 850ºC and for 5 hours at 900ºC and 910ºC. The microstructure and thermal stability of the electrochemically deposited gold films before and after annealing was investigated using scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) techniques. It is found that with increase of the annealing temperature the grain size of the deposits, the intensity of //GD fiber texture and the volume fraction, average grain size of cube and rotated cube texture components are also increased whereas the number of grains decreased. Though maximum intensity of the //GD fiber texture increases upon annealing, the deposition texture of gold film remains unchanged. The transformation of texture component of the annealed gold samples is explained by grain growth only.

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IITH Creators:
IITH CreatorsORCiD
Dey, Suhash Ranjan
Item Type: Article
Subjects: Materials Engineering > Materials engineering
Divisions: Department of Material Science Engineering
Depositing User: Team Library
Date Deposited: 28 May 2019 10:00
Last Modified: 28 May 2019 10:00
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