Area-elficient interlayer signal propagation in 3D IC by introducing electron spin

Debroy, Sanghamitra and Acharyya, Amit and Singh, Shiv Govind and Acharyya, Swati Ghosh (2017) Area-elficient interlayer signal propagation in 3D IC by introducing electron spin. In: European Conference on Circuit Theory and Design (ECCTD), 4-6 September 2017, Catania, Italy.

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Through Silicon Via (TSV) is the major technology in order to transmit data among various devices in 3D IC. Therefore higher concentration of TSV is required for higher packing density in 3D IC. In order to obtain high density of TSV, the dimensions of TSV needs to be reduced. This may be achieved by increasing the surface area per layer which will benefit in packing of more components for any operation including logic implementation. In this paper we introduce electron spin rather than charge for the first time for interlayer signal transmission in 3D IC resulting in area efficiency. Ansys electromagnetic simulator (Maxwell 2D and 3D) and OOMMF simulation supported by theoretical analysis specifies an average of 90% area reduction per layer of 3D IC as compared to state-of-the art TSV.

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IITH Creators:
IITH CreatorsORCiD
Singh, Shiv Govind
Acharyya, Amit
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: 3D IC, electron spin, area efficiency, Through Silicon via
Subjects: Electrical Engineering
Divisions: Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 10 May 2019 06:41
Last Modified: 10 May 2019 06:41
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