Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration

Panigrahi, A K and C, Hemanth Kumar and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration. In: 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 16-18 May 2017, Tokyo, Japan.

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Enhanced Cu diffusion, Cu surface passivation, and surface smoothness at the bonding interface are the key requirements for high quality Copper-Copper (Cu-Cu) thermocompression bonding. In our previous work, we have demonstrated the usage of optimized Manganin metal alloy of 3 nm not only helps in passivating the Cu surface even at high temperature (<300°C) but also reduces the surface roughness to about 0.8 nm which substantially led to high quality Cu-Cu bonding. In this paper, we demonstrate an ultra-fine pitch Cu-Cu thermocompression bonding using an optimized ultra-thin damascene compatible Manganin metal alloy passivation. This engineering surface passivation approach has led to high quality bonding at sub 200° C temperature and a nominal contact force of 4kN. Furthermore, electrical characterization using modified kelvin structure, and reliability assessment of this bonded structure was investigated under multiple current stressing, temperature cycling test and the results indicate excellent stability without electrical performance degradation. This practical finding has immense potential to leads into practical realization of 3D IC integration.

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IITH Creators:
IITH CreatorsORCiD
Vanjari, Siva Rama KrishnaUNSPECIFIED
Singh, Shiv Govindhttp://orcid.org/0000-0001-7319-879X
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Bonding, Passivation, Metals, Three-dimensional displays, Integrated circuits, Surface morphology, Imaging
Subjects: Electrical Engineering > Electrical and Electronic
Divisions: Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 20 Jun 2017 09:49
Last Modified: 16 Jan 2019 10:41
URI: http://raiith.iith.ac.in/id/eprint/3274
Publisher URL: https://doi.org/10.23919/LTB-3D.2017.7947431
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