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Number of items: 133.

Article

Tripathy, Suryasnata and Bhandari, Vasundhra and Sharma, Paresh and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2019) Chemiresistive DNA hybridization sensor with electrospun nanofibers: A method to minimize inter-device variability. Biosensors and Bioelectronics, 133. pp. 24-31. ISSN 0956-5663

Kanaparthi, Srinivasulu and Singh, Shiv Govind (2019) Chemiresistive Sensor Based on Zinc Oxide Nanoflakes for CO2 Detection. ACS Applied Nano Materials, 2 (2). pp. 700-706. ISSN 2574-0970

Bonam, Satish and Panigrahi, Asisa Kumar and Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2019) Interface and reliability analysis of Au passivated Cu-Cu fine pitch thermocompression bonding for 3D IC applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. p. 1. ISSN 2156-3950

Supraja, Patta and Sudarshan, Vadnala and Tripathy, Suryasnata and Agrawal, Amit and Singh, Shiv Govind (2019) Label free electrochemical detection of cardiac biomarker troponin T using ZnSnO3 perovskite nanomaterials. Analytical Methods, 11 (6). pp. 744-751. ISSN 1759-9660

Supraja, Patta and Tripathy, Suryasnata and Vanjari, Siva Rama Krishna and Singh, Vikrant and Singh, Shiv Govind (2019) Label free, electrochemical detection of atrazine using electrospun Mn2O3 nanofibers: Towards ultrasensitive small molecule detection. Sensors and Actuators B: Chemical, 285. pp. 317-325. ISSN 0925-4005

Kumar, Sanni and Tripathy, Suryasnata and Jyoti, Anupam and Singh, Shiv Govind (2019) Recent advances in biosensors for diagnosis and detection of sepsis: A comprehensive review. Biosensors and Bioelectronics, 124-12. pp. 205-215. ISSN 0956-5663

Kanaparthi, Srinivasulu and Kayal, Santu and Singh, Shiv Govind (2019) Simple and facile microfabrication of a flexible interdigitated capacitor for sensing applications. Flexible and Printed Electronics, 4 (1). 015005. ISSN 2058-8585

Sankatali, Venkateswarlu and Sudarsanan, Akhil and Singh, Shiv Govind and Nayak, Kaushik (2018) Ambient Temperature-Induced Device Self-Heating Effects on Multi-Fin Si n-FinFET Performance. IEEE Transactions on Electron Devices, 65 (7). pp. 2721-2728. ISSN 0018-9383

A R, Aravinth Kumar and Singh, Shiv Govind and Dutta, Asudeb (2018) Analytical design technique for real-to-real single- and dual-frequency impedance matching networks in lossy passive environment. IET Microwaves, Antennas & Propagation, 12 (6). pp. 1013-1020. ISSN 1751-8725

Panigrahi, Asisa Kumar and Ghosh, Tamal and C, Hemanth Kumar and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2018) Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering. Electronic Materials Letters. ISSN 1738-8090

Vadnala, Sudharshan and Paul, Nirupam and Agrawal, Amit and Singh, Shiv Govind (2018) Enhanced infrared sensing properties of vanadium pentoxide nanofibers for bolometer application. Materials Science in Semiconductor Processing, 81. pp. 82-88. ISSN 1369-8001

Joseph, Jose and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2018) Fabrication and characterization of SU-8-based capacitive micromachined ultrasonic transducer for airborne applications. Journal of Micro/Nanolithography, MEMS, and MOEMS, 17 (01). p. 1. ISSN 1932-5150

Vadnala, Sudharshan and Tripathy, Suryasnata and Paul, Nirupam and Agrawal, Amit and Singh, Shiv Govind (2018) Facile Synthesis of Electrospun Nickel (II) Oxide Nanofibers and Its Application for Hydrogen Peroxide Sensing. ChemistrySelect, 3 (43). pp. 12263-12268. ISSN 2365-6549

Tripathy, Suryasnata and Joseph, Jose and Vanjari, Siva Rama Krishna and Rao, AVSS Narayana and Singh, Shiv Govind (2018) Flexible ITO Electrode With Gold Nanostructures for Femtomolar DNA Hybridization Detection. IEEE Sensors Letters, 2 (4). pp. 1-4. ISSN 2475-1472

Tripathy, Suryasnata and Gangwar, Rahul and Supraja, Patta and Rao, AVSS Narayana and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) Graphene doped Mn2 O3 Nanofibers as a Facile Electroanalytical DNA Point Mutation Detection Platform for Early Diagnosis of Breast/Ovarian Cancer. Electroanalysis. ISSN 1040-0397

Joseph, Jose and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2018) Piezoelectric Micromachined Ultrasonic Transducer Using Silk Piezoelectric Thin Film. IEEE Electron Device Letters. p. 1. ISSN 0741-3106 (In Press)

Tripathy, Suryasnata and Reddy, Manne Shanmukh and Vanjari, Siva Rama Krishna and Jana, Soumya and Singh, Shiv Govind (2018) A Step Towards Miniaturized Milk Adulteration Detection System: Smartphone-Based Accurate pH Sensing Using Electrospun Halochromic Nanofibers. Food Analytical Methods. pp. 1-13. ISSN 1936-9751

Paul, Nirupam and Vadnala, Sudharshan and Panigrahi, Asisa Kumar and Kumar, C Hemanth and Agrawal, Amit and Singh, Shiv Govind (2018) Vanadium Pentoxide Nanofibers as IR Sensors for Bolometer Applications. ECS Transactions, 85 (13). pp. 1573-1583. ISSN 1938-6737

Joseph, J and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2017) Leveraging Innate Piezoelectricity of Ultra-Smooth Silk Thin Films for Flexible and Wearable Sensor Applications. IEEE Sensors Journal. ISSN 1530-437X (In Press)

Duryodhan, V S and Singh, Shiv Govind and Agarwal, Anil (2017) Effect of Cross Aspect Ratio on Flow in Diverging and Converging Microchannels. Journal of Fluids Engineering, 139 (6). 061203. ISSN 0098-2202

Prakash, M Durga and Singh, Shiv Govind and Sharma, Chandra Shekhar and Vanjari, Siva Rama Krishna (2017) Electrochemical Detection of Cardiac Biomarkers Utilizing Electrospun Multiwalled Carbon Nanotubes Embedded SU-8 Nanofibers. Electroanalysis, 29 (2). pp. 380-386. ISSN 1040 0397

Tripathy, S and Vanjari, Siva Rama Krishna and Singh, V and Swaminathan, S and Singh, Shiv Govind (2017) Electrospun manganese (III) oxide nanofiber based electrochemical DNA-nanobiosensor for zeptomolar detection of dengue consensus primer. Biosensors and Bioelectronics, 90. pp. 378-387. ISSN 0956-5663

Duryodhan, V S and Singh, Shiv Govind and Agrawal, A (2017) Heat rate distribution in converging and diverging microchannel in presence of conjugate effect. International Journal of Heat and Mass Transfer, 104. pp. 1022-1033. ISSN 0017-9310

Paul, K B and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Highly Sensitive Electrospun Multiwalled Carbon Nanotubes Embedded Zinc Oxide Nanowire Based Interface for Label Free Biosensing. Procedia Technology, 27. pp. 217-218. ISSN 2212-0173

Paul, K Brince and Vanjari, Siva Rama Krishna and Singh, Shiv Govind et. al (2017) Highly-sensitive Label-free Differential Pulse Voltammetric Immunosensor for Diagnosis of Infectious Diseases Based on Electrospun Copper Doped ZnO Nanofiber Biosensing Platform. Procedia Technology, 27. pp. 219-220. ISSN 22120173

Duryodhan, V S and Chatterjee, Rajeswar and Singh, Shiv Govind and Agrawal, Amit (2017) Mixing in planar spiral microchannel. Experimental Thermal and Fluid Science, 89. pp. 119-127. ISSN 0894-1777

K, Brince Paul and Panigrahi, Asisa Kumar and Singh, Vikrant and Singh, Shiv Govind (2017) Nonlithographic Fabrication of Plastic-based Nanofibers Integrated Microfluidic Biochip for Sensitive Detection of Infectious Biomarker. ACS Applied Materials & Interfaces. ISSN 1944-8244 (In Press)

Paul, K B and Singh, V and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) One step biofunctionalized electrospun multiwalled carbon nanotubes embedded zinc oxide nanowire interface for highly sensitive detection of carcinoma antigen-125. Biosensors and Bioelectronics, 88. pp. 144-152. ISSN 0956-5663

Trinadh, A Satya and Potluri, Seetal and Ch, Sobhan Babu and Kamakoti, V and Singh, Shiv Govind (2017) Optimal Don’t Care Filling for Minimizing Peak Toggles During At-Speed Stuck-At Testing. Transactions on Design Automation of Electronic Systems, 23 (1). pp. 1-26. ISSN 1084-4309

Panigrahi, Asisa Kumar and Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind Et. al (2017) Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications. Japanese Journal of Applied Physics, 57 (2S1). 02BC04. ISSN 0021-4922

Panigrahi, A K and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 degrees C Cu-Cu Wafer on Wafer Thermocompression Bonding. IEEE Transactions on Electron Devices, 64 (3). pp. 1239-1245. ISSN 0018-9383

Panigrahi, A K and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu-Cu Wafer on Wafer Thermocompression Bonding. IEEE Transactions on Electron Devices. ISSN 0018-9383

Joseph, J and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2017) Ultra-smooth e-beam evaporated amorphous silicon thin films – A viable alternative for PECVD amorphous silicon thin films for MEMS applications. Materials Letters, 197. pp. 52-55. ISSN 0167-577X

Tripathy, S and Ghole, A R and Deep, K and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) A comprehensive approach for milk adulteration detection using inherent bio-physical properties as ‘Universal Markers’: Towards a miniaturized adulteration detection platform. Food Chemistry, 217. pp. 756-765. ISSN 0308-8146

Paul K, B and Panigrahi, A K and Singh, V and Singh, Shiv Govind (2017) A multi-walled carbon nanotube–zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection. Analyst, 142 (12). pp. 2128-2135. ISSN 0003-2654

Duryodhan, V S and Singh, A and Singh, Shiv Govind and Agrawal, A (2016) Three-Dimensional Numerical Study of Conjugate Heat Transfer in Diverging Microchannel. Proceedings of the Indian National Science Academy, 82 (2). pp. 321-328. ISSN 0370-0046

Panigrahi, A K and Bonam, S and Ghosh, T and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2016) Ultra-thin TI passivation mediated breakthrough in High quality CU-CU bonding at low temperature and pressure. Materials Letters, 169. pp. 269-272. ISSN 0167-577X

Durga Prakash, M and Vanjari, Siva Rama Krishna and Sharma, C S and Singh, Shiv Govind (2016) Ultrasensitive, Label Free, Chemiresistive Nanobiosensor Using Multiwalled Carbon Nanotubes Embedded Electrospun SU-8 Nanofibers. Sensors, 16 (9). p. 1354. ISSN 1424-8220

Paul, K B and Kumar, S and Tripathy, S and Vanjari, Siva Rama Krishna and Singh, V and Singh, Shiv Govind (2016) A highly sensitive self assembled monolayer modified copper doped zinc oxide nanofiber interface for detection of Plasmodium falciparum histidine-rich protein-2: Targeted towards rapid, early diagnosis of malaria. Biosensors and Bioelectronics, 80. pp. 39-46. ISSN 0956-5663

Duryodhan, V S and Singh, A and Singh, Shiv Govind and Agrawal, A (2016) A simple and novel way of maintaining constant wall temperature in microdevices. Scientific Reports. pp. 1-15. ISSN 2045-2322

Matta, D P and Tripathy, S and Vanjari, Siva Rama Krishna and Sharma, C S and Singh, Shiv Govind (2016) An ultrasensitive label free nanobiosensor platform for the detection of cardiac biomarkers. Biomedical Microdevices, 18 (6). ISSN 1387-2176

Duryodhan, V S and Singh, A and Singh, Shiv Govind and Agrawal, A (2015) Convective heat transfer in diverging and converging microchannels. International Journal of Heat and Mass Transfer, 80. pp. 424-438. ISSN 0017-9310

Ghosh, T and K, Krushnamurthy and Panigrahi, A A and Dutta, Asudeb and Ch, Subrahmanyam and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding. RSC Advances (5). pp. 103643-103648. ISSN 2046-2069

Sharma, A K and Gautam, A K and Farinelli, P and Dutta, A and Singh, Shiv Govind (2015) A Ku band 5 bit MEMS phase shifter for active electronically steerable phased array applications. Journal of Micromechanics and Microengineering, 25 (035014). ISSN 0960-1317

Bhide, R R and Singh, Shiv Govind and Duryodhan, V S and Sridharan, A and Agrawal, A (2015) Onset of Nucleate Boiling and Critical Heat Flux with Boiling Water in Microchannels. International Journal of Microscale and Nanoscale Thermal, 4 (1). pp. 25-47. ISSN 1949-4955

Mohanty, R and Karthik, C and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Realizing Area efficient Silicon Micro Structures Using Only Front End Bulk Micromachining. International Journal of Advances in Engineering Sciences and Applied Mathematics, 7 (4). pp. 191-197. ISSN 0975-0770

Chatterjee, U and Das, A and Ghosh, T and Duttagupta, S P and Gandhi, M N and Singh, Shiv Govind (2014) Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application. Microelectronic Engineering, 126. pp. 84-87. ISSN 0167-9317

Duryodhan, V S and Singh, Shiv Govind and Agrawal, A (2014) Liquid flow through converging microchannels and a comparison with diverging microchannels. Journal of Micromechanics and Microengineering, 24 (12). ISSN 0960-1317

Duryodhan, V S and Singh, Shiv Govind and Agrawal, A (2013) Boiling flow through diverging microchannel. Sadhana, 38 (6). pp. 1067-1082. ISSN 0256-2499

Duryodhan, V S and Singh, Shiv Govind and Agrawal, A (2013) Liquid flow through a diverging microchannel. Microfluidics and Nanofluidics, 14 (1-2). pp. 53-67. ISSN 1613-4982

Agrawal, A and Duryodhan, V S and Singh, Shiv Govind (2012) Pressure drop measurements with boiling in diverging microchannel. Frontiers in Heat and Mass Transfer, 3 (1). ISSN 2151-8629

Singh, Shiv Govind and Agrawal, A and Duttagupta, S P (2011) Reliable MOSFET operation using two-phase microfluidics in the presence of high heat flux transients. Journal of Micromechanics and Microengineering, 21 (10). ISSN 0960-1317

Bhide, R R and Singh, Shiv Govind and Sridharan, A and Agrawal, A (2011) An active control strategy for reduction of pressure instabilities during flow boiling in a microchannel. Journal of Micromechanics and Microengineering, 21 (3). ISSN 0960-1317

Tikekar, M and Singh, Shiv Govind and Agrawal, A (2010) Measurement and modeling of pulsatile flow in microchannel. Microfluidics and Nanofluidics, 9 (6). pp. 1225-1240. ISSN 1613-4982

Book Section

Paul, K B and Panigrahi, Asisa Kumar and Singh, Shiv Govind (2018) A Low-Cost Disposable Microfluidic Biochip for malaria diagnosis. In: Gandhian Young Technological Innovation. Honey Bee Network, New Delhi, pp. 13-14. ISBN 81871602046

Vamsi, N and Dutta, P V A and Singh, Shiv Govind (2016) A 1V, -26dBm Sensitive Auto Configurable Mixed Converter Mode RF Energy Harvesting With Wide Input Range. In: IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS). IEEE International Symposium on Circuits and Systems . IEEE, pp. 1534-1537. ISBN 978-1-4799-5341-7

Hafeez, K T and Dutta, Asudeb and Singh, Shiv Govind and Avalur, K K G (2016) A Low-cost Multi-phase 3A Buck Converter With Improved Ripple Cancellation for Wide Supply Range. In: IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS). IEEE International Symposium on Circuits and Systems . IEEE, pp. 1618-1621. ISBN 978-1-4799-5341-7

Chaurasiya, D and Srinivasan, B and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) U-8 based flexure-FET biosensor to achieve ultra sensitive response. In: Advanced Materials: TechConnect Briefs 2015 NSTI. CRC Press. ISBN 9781498747271

Sharma, A K and Gautam, A K and Sastry, D V K and Singh, Shiv Govind (2012) Design & Modeling of 6-Bit Low Loss Ka Band Distributed MEMS Phase Shifter on GaAs. In: Advanced Materials Research. Scientific.Net, Kuala Lumpur; Malaysia, pp. 4179-4183.

Conference or Workshop Item

C, Hemanth Kumar and Panigrahi, Asisa Kumar and Bonam, S and Paul, Nirupam and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding. In: 68th IEEE Electronic Components and Technology Conference, 29 May-1 June 2018, United States.

Josenh, Jose and Kumar, Manish and Trinathy, Survasnata and G D V, Santhosh Kumar and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2018) Exploring the Piezoelectric Property of Electrospun Silk Nanofibers for Sensing Applications. In: IEEE SENSORS, 28-31 October 2018, New Delhi.

Bonam, Satish and Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) Gold Passivated Cu-Cu Bonding At 140°C For 3D IC Packaging And Heterogeneous Integration Applications. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), 4-7 December 2018, Singapore.

Panigrahi, Asisa Kumar and C, Hemanth Kumar and Bonam, S and K, Brince Paul and Ghosh, Tamal and Paul, Nirupam and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications. In: 68th IEEE Electronic Components and Technology Conference, 28 May-1 June 2018, United States.

Sarkar, Lisa and Joseph, J and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2018) Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications. In: IEEE SENSORS, 28-31 October 2018, New Delhi.

Kumar, C Hemanth and Paul, Nirupam and Bonam, Satish and Vanjari, Siva Rama Krishna and Singh, Shiv Govind and Panigrahi, Asisa Kumar (2018) Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application. In: IEEE International Interconnect Technology Conference (IITC), Santa Clara, CA, USA, 4-7 June 2018.

C, Hemanth Kumar and Bonam, S and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip, low form factor-microfluidics for 3D IC cooling applications. In: IEEE CPMT Symposium Japan (ICSJ), 19-21 November 2018, Japan.

Debroy, Sanghamitra and Acharyya, Amit and Singh, Shiv Govind and Acharyya, Swati Ghosh (2017) Area-elficient interlayer signal propagation in 3D IC by introducing electron spin. In: European Conference on Circuit Theory and Design (ECCTD), 4-6 September 2017, Catania, Italy.

Panigrahi, A K and Ghosh, T and Vanjari, S R K and Singh, Shiv Govind (2017) Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration. In: 67thElectronic Components and Technology Conference (ECTC), 30 May-2 June 2017.

Nagahara, Masaaki and Challapalli, Niharika and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Electrospun polyaniline nanofiber based chemiresistive nanobiosensor platform for DNA Hybridization detection. In: 16th IEEE SENSORS Conference, ICSENS 2017, 30 October 2017 to 1 November 2017, Scottish Event Campus (SEC)Glasgow; United Kingdom.

Paul, Nirupam and Singh, Shiv Govind and Vanjari, Siva Rama Krishna et. al. (2017) Fabrication of Si Membrane using Frontend Bulk Micromachining. In: XIX International Workshop on Physics of Semiconductor Devices, IWPSD, New Delhi, India.

Kumar, C Hemanth and Panigrahi, Asisa Kumar and Singh, Shiv Govind (2017) Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials. In: 49th international conference on solid state devices and materials (SSDM).

Patil, S and Kumar Panigrahi, A and Bonam, S and C, Hemanth Kumar and Krishan Singh, O and Singh, Shiv Govind (2017) Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. In: IEEE International 3D Systems Integration Conference, 3DIC, 8-11 November, 2016, San Francisco; United States.

Kumar Panigrahi, A and Bonam, S and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. In: IEEE International 3D Systems Integration Conference, 3DIC, 8-11 November, 2016, San Francisco; United States.

C, Hemanth Kumar and Kumar Panigrahi, A and Krishan Singh, O and Singh, Shiv Govind (2017) Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. In: IEEE International 3D Systems Integration Conference, 3DIC, 8-11 November, 2016, San Francisco; United States.

Khurram, K and Kumar Panigrahi, A and Bonam, S and Krishan Singh, O and Singh, Shiv Govind (2017) Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. In: IEEE International 3D Systems Integration Conference, 3DIC, 8-11 November, 2016, San Francisco; United States.

Panigrahi, A K and C, Hemanth Kumar and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2017) Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration. In: 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 16-18 May 2017, Tokyo, Japan.

Panigrahi, Asisa Kumar and Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind et. al (2017) Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration. In: 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 16-18 May 2017, Tokyo, Japan.

Kakarla, A and Qureshi, A and T, Shashidhar and S, De and Singh, Shiv Govind and Jana, Soumya (2017) Source localization via aermod-based simulation under mean squared error criterion: Demonstration using field data. In: 37th Annual IEEE International Geoscience and Remote Sensing Symposium, IGARSS 2017, 23-28 July 2017, Fort Worth, United States.

Kumar, C Hemanth and Vanjari, Siva Rama Krishna and Singh, Shiv Govind et. al. (2017) WoW Post-CMOS compatible Cu-Cu Low temperature, Low pressure thermocompression bonding with Pd passivation Engineering. In: 19th International Workshop on Physics of Semiconductor Devices, IWPSD, 11-15 December 2017, New Delhi, India.

N, Vamsi and Ragulagadda, S S R and Dutta, Asudeb and Singh, Shiv Govind (2016) A-34dBm Sensitivity Battery-less Wake-U Receiver with Digital Decoder. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 25-28 Oct. 2016, Jeju, SOUTH KOREA.

Singh, S and Kumar Panigrahi, A and Krishan Singh, O and Singh, Shiv Govind (2016) Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. In: IEEE International 3D Systems Integration Conference, 3DIC, 8-11 November, 2016, San Francisco; United States.

Joseph, J and Saraswathi, S and Agarwal, A and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2016) Silk piezoelectric thin films: Materials to devices. In: IEEE SENSORS, 30 Oct-3 Nov 2016.

Hafeez, K T and Dutta, Asudeb and Singh, Shiv Govind and Avalur, Krishna Kanth Gowri (2016) Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters. In: International Midwest Symposium on Circuits and Systems (MWSCAS), 16-19 October 2016, Abu Dhabi, United Arab Emirates.

Paul, B and Reddy, R R and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2016) Zinc oxide nanowire modified flexible plastic platform for immunosensing. In: IEEE SENSORS, 30 Oct.-3 Nov. 2016.

Hafeez, K T and Dutta, Asudeb and Singh, Shiv Govind and Avalur, K K G (2016) A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 25-28 Oct. 2016, Jeju, SOUTH KOREA.

Jha, P and Patra, P and Naik, J and Acharyya, Amit and P, Rajalakshmi and Singh, Shiv Govind and Dutta, Asudeb (2016) A reconfigurable medically cohesive biomedical front-end with ΣΔ ADC in 0.18µm CMOS. In: 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 25-29 Aug, 2015, Milan.

Gupta, N and Kumar, A R R and Dutta, Asudeb and Singh, Shiv Govind (2015) A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology. In: 28th IEEE International System-on-Chip Conference (SOCC), 8-11 Sept. 2015, Beijing, PEOPLES R CHINA.

Jha, P and Patra, P and Naik, J and Dutta, Asudeb and Acharyya, Amit and P, Rajalakshmi and Singh, Shiv Govind (2015) A 2 mu W Biomedical Frontend with Sigma Delta ADC for Self-powered U-Healthcare Devices in 0.18 mu m CMOS Technology. In: 13th IEEE International NEW Circuits and Systems Conference, JUN 07-10, 2015, Grenoble, FRANCE.

Vamsi, N and Kaddi, P and Dutta, Asudeb and Singh, Shiv Govind (2015) A −30 dBm sensitive ultra low power RF energy harvesting front end with an efficiency of 70.1% at −22 dBm. In: 28th IEEE International System-on-Chip Conference (SOCC), 8-11 Sept. 2015, Beijing, PEOPLES R CHINA. (In Press)

A, Satya Trinadh and Ch, Sobhan Babu and Singh, Shiv Govind and V, Kamakoti (2015) DP-fill: a dynamic programming approach to X-filling for minimizing peak test power in scan tests. In: Conference on Design, Automation and Test in Europe, 9-13 March 2015, Grenoble, France.

Joseph, J and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2015) Fabrication of SU-8 based Capacitive Micromachined Ultrasonic Transducer for low frequency therapeutic applications. In: 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 25-29 Aug, 2015, Milan.

Paul, B and Prakash, D and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2015) Highly sensitive SAM modified electrospun zinc oxide nanofiber based label free biosensing platform. In: IEEE, SENSORS, 1-4 Nov. 2015, Busan.

Ghosh, T and Gagan, G C and Dutta, Asudeb and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC. In: 65th IEEE Electronic Components and Technology Conference (ECTC), 26-29 May, 2015, San Diego, CA, USA.

Panigrahi, A K and Bonam, S and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. In: International 3D Systems Integration Conference (3DIC), Aug. 31 2015-Sept. 2 2015, Sendai.

Kumar, A R A and Singh, Shiv Govind and Dutta, Asudeb (2015) Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors. In: IEEE International Symposium on Circuits and Systems (ISCAS), 24-27 May, 2015, Lisbon.

Panigrahi, A K and Bonam, S and Ghosh, T and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration. In: 65th IEEE Electronic Components and Technology Conference (ECTC), 26-29 May, 2015, San Diego, CA, USA.

Jha, P and Patra, P and Naik, J and Acharyya, Amit and P, Rajalakshmi and Singh, Shiv Govind and Dutta, Asudeb (2015) A Reconfigurable Medically Cohesive Biomedical Front-End with Sigma Delta ADC in 0.18 mu m CMOS. In: 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 25-29 Aug, 2015, Milan, Italy.

Ghosh, T and Krushnamurthy, E and Ch, Subrahmanyam and Vanjari, Siva Rama Krishna and Dutta, Asudeb and Singh, Shiv Govind (2015) Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding. In: 65th IEEE Electronic Components and Technology Conference (ECTC), 26-29 May, 2015, San Diego, CA, USA.

Reddy, R R and Tanna, S and Singh, Shiv Govind and Singh, O K (2015) TSV noise coupling in 3D IC using guard ring. In: International 3D Systems Integration Conference (3DIC), Aug. 31 2015-Sept. 2 2015, Sendai.

Vamsi, N and Gupta, A and Dutta, Asudeb and Singh, Shiv Govind (2015) Ultra low power on-chip hybrid start-up for wireless sensor networks. In: Nordic Circuits Systems Conference (NORCAS): NORCHIP & International Symposium on System Chip (SoC), OCT 26-28, 2015, Oslo, NORWAY.

Gupta, N and Dutta, Asudeb and Singh, Shiv Govind (2015) A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process. In: Nordic Circuits Systems Conference (NORCAS): NORCHIP & International Symposium on System Chip (SoC), OCT 26-28, 2015, Oslo, NORWAY.

Shourya, K and Mantha, A and Y B, Priyamvada and Chowdary, Gajendranath and Singh, Shiv Govind and Dutta, Asudeb (2015) A wide input voltage range start-up circuit for solar energy harvesting system. In: 2015 6th Asia Symposium on Quality Electronic Design (ASQED)2015 6th Asia Symposium on, 4-5 Aug, 2015, Kula Lumpur, Malaysia.

Kaddi, P and Reddy, B K and Singh, Shiv Govind (2014) Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs. In: 27th International Conference on VLSI Design and 13th International Conference on Embedded Systems, 5-9 Jan. 2014, Mumbai.

M, Durga Prakash and Vanjari, Siva Rama Krishna and Dutta, Asudeb and Challa, Subrahmanya Sastry and Singh, Shiv Govind (2014) Development of MWCNT/SU-8 nanofiber composite using electrospinning technique for biosensing applications. In: SENSORS, 2014 IEEE, 2-5 Nov, 2014, Valencia.

Paul, B and Sharma, C S and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2014) Fabrication and characterization of zinc oxide nanowires for high-sensitivity sensing applications. In: IEEE 2nd International Conference on Emerging Electronics (ICEE), Bengalore, 3-6 Dec. 2014.

Joseph, J and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2014) A low pull-in SU-8 based Capacitive Micromachined Ultrasonic Transducer for medical imaging applications. In: 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC, 26-30 August 2014, Chicago; United States.

Ghosh, T and Dutta, Asudeb and Singh, Shiv Govind (2013) Copper Protection by SAM and Low Temperature Bonding for 3dimentional Integration. In: 2nd International Conference on Materials Science and Technology, ICMST 2013, 11-12, April 2013, Hong Kong; China.

Gupta, N and Kumar, A R A and Dutta, Asudeb and Singh, Shiv Govind (2013) Design of Subthreshold Wide Band down Conversion Mixer. In: 5th IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics, PrimeAsia 2013, 19-21 December 2013, Visakhapatnam; Indonesia.

Khan, A A and Ohnari, Y and Dutta, Asudeb and Singh, Shiv Govind and Miura Mattausch, M and Mattausch, H J (2013) Die-to-die and within-die fabrication variation of 65nm CMOS technology PMOS transistors. In: International Conference on Electronics, Computing and Communication Technologies (CONECCT), 17-19 Jan. 2013, Bangalore.

Hafeez, K T and Dutta, Asudeb and Singh, Shiv Govind and K, Siva Kumar and Avalur, K K and Sai, V H (2013) Hybrid Structured Buck Converter with Ripple Cancellation and Improved Efficiency. In: Annual IEEE India Conference (INDICON), 13-15, December 2013, Mumbai; India.

Singh, A V and Chaturvedi, D and Singh, Shiv Govind and Khan, Mohammed Zafar Ali (2013) Power Dissipation Analysis for Different Configurations of Tsvs at High (Ghz) Frequencies. In: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, 28-31, May 2013, Las Vegas, NV; United States.

Patel, S B and Ghosh, T and Dutta, Asudeb and Singh, Shiv Govind (2013) Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV). In: 63rd Electronic Components and Technology Conference (ECTC), 28-31 May 2013, Las Vegas, NV.

Kumar, A R A and Dutta, Asudeb and Singh, Shiv Govind (2012) Noise-cancelled subthreshold UWB LNA for Wireless Sensor Network application. In: IEEE International Conference on Ultra-Wideband (ICUWB), 17-20 September, 2012, Syracuse, NY; United States.

Aravinth Kumar, A R and Dutta, Asudeb and Singh, Shiv Govind (2012) A 1.5-7.5GHz low power low noise amplifier (LNA) design using subthreshold technique for Wireless Sensor Network (WSN) application. In: IEEE International Symposium on Circuits and Systems, 20-23, May 2012, Seoul; South Korea.

Shabana, S and Thej, C and Sankar, H and Pandava, R and Dutta, Asudeb and Singh, Shiv Govind (2012) Design of highly efficient charge pump for energy harvesting RFID applications. In: Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics, 5-7, December 2012, Hyderabad; India.

Hafeez, K T and Dutta, Asudeb and Singh, Shiv Govind (2012) Efficient adaptive switch design for charge pumps in micro-scale energy harvesting. In: 20th IFIP/IEEE International Conference on Very Large Scale Integration, 7-10, October 2012, Santa Cruz, CA; United States.

Jha, P K and Dutta, A and Y B, Nithin Kumar and Singh, Shiv Govind (2012) Modeling a IF double sampling bandpass switched capacitor ΣΔ ADC with a symmetric noise transfer function for WiMAX/WLAN. In: 5th International Conference on Computers and Devices for Communication (CODEC), 17-19 Dec. 2012, Kolkata.

Ghosh, Tamal and Dutta, Asudeb and E, Linga Reddy and Ch, Subrahmanyam and Singh, Shiv Govind (2012) Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs. In: 2012 International Conference on Emerging Electronics, 15-17 December 2012, Mumbai, India.

Khan, A A and Patel, S B and Chaturvedi, D and Dutta, A and Singh, Shiv Govind (2012) Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge. In: International Conference on Emerging Electronics (ICEE), 15-17 Dec. 2012, Mumbai.

Kumar, A R A and Dutta, Asudeb and Singh, Shiv Govind (2012) Transformer coupled novel noise cancellation technique for subthreshold UWB LNA. In: 5th International Conference on Computers and Devices for Communication, 17-19, December 2012, Kolkata; India.

Reddy, S P and Dutta, Asudeb and Singh, Shiv Govind (2012) A reconfigurable aperture coupled microstrip patch antenna with beam steering capability on silicon. In: IEEE Asia Pacific Conference on Circuits and Systems, 2-5 December, 2012, Kaohsiung; Taiwan.

Rao, T and Dutta, Asudeb and Singh, Shiv Govind and De, A and Sahoo, B D (2012) A tuneable CMOS pulse generator for detecting the cracks in concrete walls. In: IEEE Computer Society Annual Symposium on VLSI, 19-21, August 2012, Amherst, MA; United States.

Thesis

A, Satya Trinadh and Ch, Sobhan Babu and Singh, Shiv Govind (2018) Algorithms for Power Aware Testing of Nanometer Digital ICs. PhD thesis, Indian Institute of Technology Hyderabad.

P M, Greeshma and Singh, Shiv Govind (2018) Fabrication of micro separation column for miniaturized gas chromatography system. Masters thesis, Indian Institute of Technology Hyderabad.

Singh, Arvind Kumar and Singh, Shiv Govind (2018) Miniaturization of PCR Machine. Masters thesis, Indian Institute of Technology Hyderabad.

Joseph, J and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2018) alternative Materials/Approaches to Develop Miniaturized Ultrasonic Transducers-A Device. PhD thesis, Indian Institute of Technology, Hyderabad.

Paul, K B and Singh, Shiv Govind (2017) Zinc Oxide Nanowire Based Biosensors on Flexible Substrate for Point -Of -Care Applications. PhD thesis, Indian Institute of Technology Hyderabad.

Vhatkar, Swapnil and Singh, Shiv Govind (2017) Integrated Readout Circuitry for Single Pixel Infrared Sensor: Infrared Thermometer. Masters thesis, Indian Institute of Technology Hyderabad.

Suraj, Suraj and Singh, Shiv Govind (2017) Room Temperature Carbon Dielectric based Capacitive sensor for ammonia sensing. Masters thesis, Indian Insitute of Technology Hyderabad.

B, Srinivasan and Singh, Shiv Govind (2015) Design, Process Development and Fabrication of SU-8 based CMOS Compatible Capacitive MEMS Platform for Bio-sensing Applications. Masters thesis, Indian Institute of Technology Hyderabad.

M D, Jamal and Dutta, Asudeb and Singh, Shiv Govind (2012) Spur Reduction in Phase Lock Loop Using Charge Pump Current Matching Technique. Masters thesis, Indian Institute of Technology Hyderabad.

P, Rajendra and Dutta, Asudeb and Singh, Shiv Govind (2011) Analysis of Impact of Transformer Coupled Input Matching on Concurrent Dual-Band Low Noise Amplifier. Masters thesis, Indian Institute of Technology.

Other

Singh, Shiv Govind (2018) President Award received by Shivu under Guidence of Dr. Shiv Gobind Sinngh. ..

This list was generated on Thu Jun 20 18:47:57 2019 IST.