Development of Ni–Cu Materials Library by Using Combinatorial Pulsed Electrodeposition

Srinivas, P. and Hamann, Sven and Dey, Suhash Ranjan (2013) Development of Ni–Cu Materials Library by Using Combinatorial Pulsed Electrodeposition. Transactions of the Indian Institute of Metals, 66 (4). pp. 429-432. ISSN 0972-2815

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Abstract

Combinatorial materials fabrication and high-throughput characterization methods offer a new experimental paradigm to accelerate the enhancement of known and the discovery of new materials in materials science and engineering. In this study, the composition spread library of binary Ni–Cu alloy system is synthesized combinatorially onto a copper substrate using pulsed electrodeposition (PED) from a single sulfate bath with a complexing agent trisodium citrate in a modified Hull cell. Different current densities are expected on the tilted cathode which varied the composition along lateral direction and generated Ni–Cu binary spread. Crystallographic structure as well as atomic concentration of the constituent elements of the deposited binary Ni–Cu alloy film along the lateral direction is determined as a function of fabrication parameters. The presented results indicate the successful development of Ni–Cu binary spread (10–90 at.%) via PED.

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IITH Creators:
IITH CreatorsORCiD
Dey, Suhash Ranjanhttp://orcid.org/0000-0002-5148-9534
Item Type: Article
Subjects: Materials Engineering > Materials engineering
Divisions: Department of Material Science Engineering
Depositing User: Library Staff
Date Deposited: 17 Sep 2019 06:48
Last Modified: 17 Sep 2019 06:48
URI: http://raiith.iith.ac.in/id/eprint/6278
Publisher URL: http://doi.org/10.1007/s12666-013-0249-7
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