Electrochemical self-assembled monolayer desorption assisted low temperature Cu-Cu thermocompression bonding

Ghosh, T and Singh, Shiv Govind and Vanjari, Siva Rama Krishna (2014) Electrochemical self-assembled monolayer desorption assisted low temperature Cu-Cu thermocompression bonding. In: ICEE 2014, 3-6 December 2014, Bangalore, India.

Full text not available from this repository. (Request a copy) [error in script]
IITH Creators:
IITH CreatorsORCiD
Singh, Shiv Govindhttp://orcid.org/0000-0001-7319-879X
Item Type: Conference or Workshop Item (Paper)
Subjects: Electrical Engineering
Divisions: Department of Electrical Engineering
Depositing User: Library Staff
Date Deposited: 12 Sep 2019 05:01
Last Modified: 12 Sep 2019 05:01
URI: http://raiith.iith.ac.in/id/eprint/6199
Publisher URL:
Related URLs:

    Actions (login required)

    View Item View Item
    Statistics for RAIITH ePrint 6199 Statistics for this ePrint Item