Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials

Kumar, C Hemanth and Panigrahi, Asisa Kumar and Singh, Shiv Govind (2017) Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials. In: 49th international conference on solid state devices and materials (SSDM).

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Abstract

Polder and Van Hove in 1971 forecasted, it is possible to transfer heat between the planer surface by phonon tunneling mechanism, having interlayer separation that is comparable to the phonon wavelength. Towards that, in this work we examined the heat mitigation issues widely prevalent in 3D stacked ICs using finite element analysis. We observed batter heat mitigation by using optimized thickness of heat spreader sandwiched between ICs, containing TTSVs. FEM result shows nearly 15 oC reduction in temperature from 313oC to 298 oC of the top most IC in a 3D stack compared with the case without TTSV and heat spreader in the ILD plane.

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IITH Creators:
IITH CreatorsORCiD
Singh, Shiv Govindhttp://orcid.org/0000-0001-7319-879X
Item Type: Conference or Workshop Item (Paper)
Subjects: Electrical Engineering
Divisions: Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 15 May 2019 06:52
Last Modified: 15 May 2019 06:52
URI: http://raiith.iith.ac.in/id/eprint/5170
Publisher URL:
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