Stress and frequency analysis of silicon diaphragm of MEMS based piezoresistive pressure sensor

Samridhi, Samridhi and Kumar, Manish and Dhariwal, Sachin and Singh, Kulwant and Alvi, P A (2019) Stress and frequency analysis of silicon diaphragm of MEMS based piezoresistive pressure sensor. International Journal of Modern Physics B. ISSN 0217-9792 (In Press)

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Abstract

This paper reports the stress and frequency analysis of dynamic silicon diaphragm during the simulation of micro-electro-mechanical-systems (MEMS) based piezoresistive pressure sensor with the help of finite element method (FEM) within the frame work of COMSOL software. Vibrational modes of rectangular diaphragm of piezoresistive pressure sensor have been determined at different frequencies for different pressure ranges. Optimal frequency range for particular applications for any diaphragm is a very important so that MEMS sensors performance should not degrade during the dynamic environment. Therefore, for the MEMS pressure sensor having applications in dynamic environment, the diaphragm frequency of 280 KHz has been optimized for the diaphragm thickness of 50 μm and hence this frequency can be considered for showing the better piezoresistive effect and high sensitivity. Moreover, the designed pressure sensor shows the high linearity and enhanced sensitivity of the order of (∼0.5066 mV/psi).

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IITH Creators:
IITH CreatorsORCiD
Item Type: Article
Subjects: Electrical Engineering
Divisions: Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 16 Mar 2019 09:40
Last Modified: 16 Mar 2019 09:40
URI: http://raiith.iith.ac.in/id/eprint/4886
Publisher URL: http://doi.org/10.1142/S0217979219500401
OA policy: http://www.sherpa.ac.uk/romeo/issn/0217-9792/
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