Ultra-smooth e-beam evaporated amorphous silicon thin films – A viable alternative for PECVD amorphous silicon thin films for MEMS applications

Joseph, J and Singh, S G and Vanjari, S R K (2017) Ultra-smooth e-beam evaporated amorphous silicon thin films – A viable alternative for PECVD amorphous silicon thin films for MEMS applications. Materials Letters, 197. pp. 52-55. ISSN 0167-577X

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Abstract

In this paper, we demonstrate the applicability of ultra-smooth e-beam evaporated amorphous silicon thin films (<500 nm) as an alternative for PECVD thin films in MEMS applications. In this regard, a thorough investigation of the material and structural characteristics of low-temperature e-beam evaporated amorphous silicon thin films is carried out and it reveals that these properties are very similar to that of PECVD silicon thin films. E-beam evaporated amorphous silicon offers an ultra-smooth surface, which helps in realizing MEMS devices with close to ideal frequency response. The suitability of these thin films for MEMS applications is demonstrated by fabricating micro-cantilevers using the optimized thin film deposition conditions.

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IITH Creators:
IITH CreatorsORCiD
Singh, S Ghttp://orcid.org/0000-0001-7319-879X
Vanjari, S R KUNSPECIFIED
Item Type: Article
Uncontrolled Keywords: Amorphous materials; Deposition; Thin films
Subjects: Others > Electricity
Divisions: Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 04 Apr 2017 09:15
Last Modified: 19 Jul 2017 08:57
URI: http://raiith.iith.ac.in/id/eprint/3123
Publisher URL: https://doi.org/10.1016/j.matlet.2017.03.158
OA policy: http://www.sherpa.ac.uk/romeo/issn/0167-577X/
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