Component fault localization using switching current measurements

Potluri, S and Trinadh, A S and Saraf, S and Veezhinathan, K (2016) Component fault localization using switching current measurements. In: 21th IEEE European Test Symposium (ETS), 23-27 May 2016.

Full text not available from this repository. (Request a copy)

Abstract

Conventional manufacturing/system tests point to a set of logically equivalent faults and not the exact fault within a faulty component. In this paper, we show that during testing, measuring the current drawn by a faulty component aids in identifying the exact manifested fault within it. We propose to partition the chip's power grid based on the chip's component partitions, and dedicate a external supply pin to each component partition. In order to minimize the cost associated with the external measurement circuitry, we reuse the scan resources available within the flip-flop to repeatedly apply the desired test-pattern pair, so that the average current measured during the launch-to-capture window, is equal to the same over a long period of time. The proposed technique is validated by simulating the power-grid and the modified flip-flop using SPICE circuit simulator. The proposed technique, when applied to several component benchmark circuits, helped to localize almost all the logically equivalent faults.

[error in script]
IITH Creators:
IITH CreatorsORCiD
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Circuit faults, Current measurement, SPICE, Fault diagnosis, Semiconductor device measurement, Time measurement, Benchmark testing
Subjects: Others > Electricity
Divisions: Department of Computer Science & Engineering
Depositing User: Team Library
Date Deposited: 28 Oct 2016 05:48
Last Modified: 28 Oct 2016 05:48
URI: http://raiith.iith.ac.in/id/eprint/2843
Publisher URL: http://dx.doi.org/10.1109/ETS.2016.7519322
Related URLs:

Actions (login required)

View Item View Item
Statistics for RAIITH ePrint 2843 Statistics for this ePrint Item