Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs

Kaddi, P and Reddy, B K and Singh, S G (2014) Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs. In: 27th International Conference on VLSI Design and 13th International Conference on Embedded Systems, 5-9 Jan. 2014, Mumbai.

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Abstract

3-D IC integration technology is recent evolution in IC fabrication which allows reduction of interconnect length, heterogeneous integration of different IC layers ...etc. But one of the challenges faced by 3-D IC is heat mitigation. Over the years to relieve the heating problem in 3-D ICs various passive cooling techniques were proposed. However due to their passive nature, performance is already saturated. So a new technique is proposed to overcome this limitation, called as active cooling technique. This technique uses the Peltier element to mitigate the heat at different IC layers. To demonstrate the advantages of this technique, thermal simulation of a stack consisting of three IC layers bonded face up is performed and extensive case studies are carried out using finite element modeling. It has been observed that by inserting an electrically isolated Peltier element that extends across IC layers to substrate reduced the temperature by ~ 15° K. The initial temperature difference between top IC layer and sink is reduced from ~ 172° K to ~ 16° K i.e a reduction of ~ 90 % compared to ~ 61.7 % with TTSV.

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IITH Creators:
IITH CreatorsORCiD
Singh, S Ghttp://orcid.org/0000-0001-7319-879X
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Peltier effect Peltier element TTSV (Thermal Through Silicon Via) Thermoelectric effect back to face bonding
Subjects: Others > Electricity
Others > Engineering technology
Divisions: Department of Electrical Engineering
Depositing User: Library Staff
Date Deposited: 23 Feb 2016 07:00
Last Modified: 19 Jul 2017 10:27
URI: http://raiith.iith.ac.in/id/eprint/2198
Publisher URL: https://doi.org/10.1109/VLSID.2014.92
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