Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding

Ghosh, T and K, Krushnamurthy and Panigrahi, A A and Dutta, Asudeb and Ch, Subrahmanyam and Vanjari, Siva Rama Krishna and Singh, Shiv Govind (2015) Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding. RSC Advances (5). pp. 103643-103648. ISSN 2046-2069

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Abstract

This paper reports Self Assembled Monolayer (SAM) of propanethiol desorption assisted low temperature, low pressure copper to copper (Cu–Cu) thermo-compression bonding, a technique which could potentially open up a whole new platform for developing next generation heterogeneous smart devices using 3D integrated circuit technology. Thiolated self assembled monolayers protect a freshly deposited copper surface from oxidation and other contamination. Removal of this SAM layer just prior to bonding would potentially bring down temperature and pressure thus rendering the process CMOS compatible. This paper focuses on using Non-Thermal Plasma (NTP) desorption, which is a simple, robust, room temperature technique for desorbing SAMs. The desorption was carried out in an indigenous chamber specifically designed for this purpose. Thermo-compression bonding post desorption resulted in a very good quality bonding with a bond strength of 132 MPa, performed at a relatively low temperature of 200 °C and a low pressure of 5 bar.

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IITH Creators:
IITH CreatorsORCiD
Dutta, AsudebUNSPECIFIED
Ch, SubrahmanyamUNSPECIFIED
Vanjari, Siva Rama KrishnaUNSPECIFIED
Singh, Shiv Govindhttp://orcid.org/0000-0001-7319-879X
Item Type: Article
Subjects: Others > Electricity
Chemistry
Divisions: Department of Chemistry
Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 05 Jan 2016 06:24
Last Modified: 11 Sep 2017 09:06
URI: http://raiith.iith.ac.in/id/eprint/2094
Publisher URL: https://doi.org/10.1039/C5RA17735A
OA policy: http://www.sherpa.ac.uk/romeo/issn/2046-2069/
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