Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding

Ghosh, T and Krushnamurthy, E and Ch, Subrahmanyam and Vanjari, Siva Rama Krishna and Dutta, Asudeb and Singh, Shiv Govind (2015) Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding. In: 65th IEEE Electronic Components and Technology Conference (ECTC), 26-29 May, 2015, San Diego, CA, USA.

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Abstract

In this paper the utility of Self Assembled Monolayer (SAM) of Propanethiol (C3) for Copper protection from oxidation and subsequent desorption of the Thiol layer from Copper surface by using cold Helium plasma has been investigated. The major bottleneck of achieving low temperature and low pressure bonding is the presence of contamination and oxidation on the Copper surface. Use of Thiol can protect the freshly deposited Copper surface from oxidation and other contamination. Removal of this Thiol layer by Helium plasma just prior to bonding can bring down the required temperature of bonding to 200° and pressure to 4kN. This technique can open up a whole new platform for low temperature bonding for 3D ICs.

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IITH Creators:
IITH CreatorsORCiD
Ch, SubrahmanyamUNSPECIFIED
Dutta, AsudebUNSPECIFIED
Singh, Shiv Govindhttp://orcid.org/0000-0001-7319-879X
Vanjari, Siva Rama KrishnaUNSPECIFIED
Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Bonding; Copper; Desorption; Helium; Low temperature operations; Monolayers; Oxidation; Self assembled monolayers; Three dimensional integrated circuits Copper protection; Helium plasmas; Low temperature bonding; Low temperatures; SAM; Thermo compression bonding; Thermo-compression; Thiol
Subjects: Others > Engineering technology
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Divisions: Department of Chemistry
Department of Electrical Engineering
Depositing User: Team Library
Date Deposited: 12 Oct 2015 10:46
Last Modified: 11 Sep 2017 09:26
URI: http://raiith.iith.ac.in/id/eprint/1972
Publisher URL: https://doi.org/10.1109/ECTC.2015.7159908
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