Development of Ni-Cu materials library by using combinatorial pulsed electrodeposition

Srinivasa Reddy, P and Hamann, S and Wambach, M and Kieschnick, M and Ludwig, A and Dey, S R (2013) Development of Ni-Cu materials library by using combinatorial pulsed electrodeposition. Transactions of the Indian Institute of Metals, 66 (4). pp. 429-432. ISSN 0972-2815

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Abstract

Combinatorial materials fabrication and high-throughput characterization methods offer a new experimental paradigm to accelerate the enhancement of known and the discovery of new materials in materials science and engineering. In this study, the composition spread library of binary Ni-Cu alloy system is synthesized combinatorially onto a copper substrate using pulsed electrodeposition (PED) from a single sulfate bath with a complexing agent trisodium citrate in a modified Hull cell. Different current densities are expected on the tilted cathode which varied the composition along lateral direction and generated Ni-Cu binary spread. Crystallographic structure as well as atomic concentration of the constituent elements of the deposited binary Ni-Cu alloy film along the lateral direction is determined as a function of fabrication parameters. The presented results indicate the successful development of Ni-Cu binary spread (10-90 at.%) via PED

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IITH Creators:
IITH CreatorsORCiD
Item Type: Article
Uncontrolled Keywords: Combinatorial approach; Ni-Cu alloys; Pulsed electrodeposition; XRD and EDX
Subjects: Others > Metallurgy
Divisions: Department of Material Science Engineering
Depositing User: Team Library
Date Deposited: 27 Nov 2014 09:04
Last Modified: 27 Nov 2014 09:04
URI: http://raiith.iith.ac.in/id/eprint/1010
Publisher URL: http://dx.doi.org/10.1007/s12666-013-0249-7
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